Technology Areas/Product Groups
Optical Fiber
To realize an information and communication infrastructure that supports the evolution of IoT (Internet of Things), it is essential to establish an optical communication network that exceeds the existing transmission capacity limits. Optcal Fiber plays a central role in this. In the IOWN concept proposed by NTT, the introduction of various new technologies is being considered with the aim of achieving three target performances: "low power consumption," "large capacity and high quality," and "low latency."
As part of our efforts to realize the IOWN concept, we have released the world's highest density Optcal Fiber cable, which uses our proprietary 12-fiber intermittently fixed Optcal Fiber ribbon, Spider Web Ribbon®. We are also advancing this technology further to develop an ultra-high-core count Optcal Fiber cable using 200μm fibers with a thinner outer diameter than the standard coating.
As part of our research and development to achieve even higher densities, we are developing a multi-core Optcal Fiber that enables higher densities by arranging multiple cores in a single Optcal Fiber cladding. With an eye on the early practical application of multi-core fibers, we are focusing on research and development of a multi-core optical fiber that has the same diameter (125 μm) as the currently used standard Optcal Fiber, but has four cores that are optically compatible with existing single-mode Optcal Fiber.


Optical Connector
Optical connectors are products that precisely align the axes Optcal Fiber and bring the end faces close together or into contact to achieve low-loss, highly reliable repeatable connections. Optical connectors are application for single-core fiber connections and multi-core bulk connections (Fig. 1), and there are multiple connection methods for each. Fujikura has core technologies in each connection method and provides a variety of solutions to meet customer applications. PC connections are a method in which the end faces Optcal Fiber are physically contacted with each other, and Fujikura has developed low-loss, multi-core optical connectors using high-precision polishing technology and precision resin molding technology. In addition to PC connections, we also provide field-assembled optical connector solutions (Fig. 2) that combine refractive index matching materials and connections using fusion splicers. In addition, in recent years, the increase in data traffic in hyperscale data center (HSDCs) has led to increased density in optical connectors and optical wiring solutions. As a solution to this problem, Fujikura is expanding its MMC ferrule connectors (Fig. 3), which are key components for small and high-density connections, and wiring solutions into these new fields. In addition, we are currently developing products compatible with 80um clad fibers to achieve even smaller and higher density. We are also working on the development of an MCF-MPO connector (Figure 4), which is a multi-core optical connector assembled from multi-core fibers that have multiple cores, which are the paths for multiple signals, in a single fiber, enabling even higher density.

Figure 1: Single-fiber and multi-fiber connectors

Figure 2: Examples of field-assembled connectors (Left: fusion-type MPO connector, Right: refractive index-matched single-fiber connector)

Figure 3: MMC vs MPO connector comparison

Figure 4: Multicore fiber (left) and MCF-MPO connector (right)
Fusion Splicer
We are working on the research and development of equipment for removing the coating of Optcal Fiber, cutting, and fusion splicing. The core position of Optcal Fiber is measured with high precision, two Optcal Fiber are aligned at the submicron level using a precision axis alignment mechanism, and fusion splicing is performed using quasi-corona discharge or CO2 laser. Fusion splicers using quasi-corona discharge with tungsten electrodes can be made compact and are mainly used to connect Optcal Fiber for communication. On the other hand, Fusion Splicer using CO2 lasers do not cause tungsten to adhere to Optcal Fiber and are mainly used to process special Optcal Fiber. The characteristics of CO2 lasers are utilized not only for connecting, but also for processing tip lenses and manufacturing optical couplers. This equipment, which makes full use of mechatronics technology, has established a position as the world's top share.




High Density Optical Cables
- 1) Increasing the number of cores laid in existing pipelines while using existing laying methods
- ② Shortening of splicing time by using SWR™ to splice ribbons together
- 3) Reduction in connection points by installing cables in a continuous manner from outdoors to inside the premises


Ultra-thin high-density WTC®

Air-blown WTC ® (AB-WTC™)
Ultra-fine coaxials
Micro coaxial cable assembly
In recent years, micro coaxial cables have been used for a variety of purposes, including mobile devices, wearable devices, and drones, and there is a need for connections with high bending and twisting characteristics in extremely limited spaces, as well as smaller diameters that are resistant to noise and transmit high-speed signals.
We are currently developing micro coaxial cables and assemblies for internal wiring in equipment that meet these needs through improvements to the internal cable structure, etc.
The photo on the right is an example of a highly flexible micro-coaxial cable. By changing the material and composition of the central conductor, we were able to achieve bending performance 10 times greater than that of conventional types. We can design and manufacturing cable structures to meet the desired bending performance.


Sensors
Pressure Sensors
As the name suggests, a pressure sensor is a sensor for measuring gas pressure. Pressure sensors are used in a wide range of fields, including industrial equipment such as pressure switches, medical equipment such as blood pressure monitors, and consumer products.
Currently, we are leveraging the development technology of high-precision pressure sensors that combine piezo-resistance pressure sensors with signal processing ICs to achieve improved precision and high output stability.
Pressure ranges range from the micro-pressure region of 2kPa to the high-pressure region of 1MPa, and outputs include analog output, digital output (I2CTM, SPI), and a variety of package shapes are available.
In order to help our customer make their electronic devices smaller and thinner, we will be releasing a 4 x 4 mm small pressure sensor (AT7) in 2024.
Going forward, we will continue to strengthen our product Lineup (名) in order to meet the increasingly diverse needs of the market.
Oxygen Sensors
Oxygen sensors are sensors used to measure oxygen concentration. Oxygen sensors are used in a wide range of fields, including medical equipment such as oxygen concentrators and incubators, and industrial equipment such as nitrogen generators.
The oxygen sensor is a limiting current type that uses a zirconia solid electrolyte that has oxygen ion conductivity at high temperatures. We manufacturing high-precision oxygen sensors by utilizing our ceramic molding technology, packaging technology, and assembly and measurement technology.



Millimeter Wave
The fifth generation mobile communication system (5G) is being introduced to provide high-quality video distribution and various applications that utilize VR/AR. 5G will make mobile networks faster and more powerful, and will enable highly reliable, ultra-low latency communication and multiple simultaneous connections. These aspect will not only improve convenience in daily life, but will also serve as infrastructure that creates new added value, such as improving the efficiency of industry and society.
5G has introduced millimeter waves (radio waves of approximately 30 GHz or higher) as a technology to realize high-speed, large-capacity, and low-latency communications. Millimeter waves have an extremely wide bandwidth and can realize revolutionary high-speed communications, but compared to microwaves (several GHz or less) that have been commonly used in the past, they are more susceptible to attenuation and degradation due to various factors, so materials, design, and manufacturing of various devices used in communication equipment require completely different ideas and advanced technologies. We are conducting research and development to improve the performance and reduce the cost of millimeter wave band communication devices. We have developed a 60 GHz millimeter wave wireless communication module that integrates a phased array antenna and a signal processing unit in the 60 GHz band, and have simultaneously achieved world-class communication speeds (>1Gbps) and long-distance transmission (>500m) (these are examples of actual values in our experimental environment and may vary depending on the surrounding environment). Furthermore, we have developed the FutureAccess™ Type-C series, including radio frequency ICs (RF-ICs) for the 28 GHz band, and 28 GHz millimeter wave antenna boards that integrate peripheral functions including RF-ICs, phased array antennas, and power circuits, with the aim of application to 5G base stations. We are also developing low-loss, high-performance devices for the millimeter wave band, such as bandpass filters, to provide total support for new generation millimeter wave communication devices.

60 GHz millimeter wave wireless communication module

28 GHz mmWave Antenna Board