ベーパーチャンバー

Product Overview

High-performance cooling device capable of handling large amounts of heat
Fully customizable specifications address the issue of high heat generation from CPUs and GPUs in HPC and servers.

Strong Point/Feature

1. Compared to heat pipes, it has better heat transfer characteristics, faster temperature response and higher temperature uniformity
2. Distributes heat across the entire surface (heat transport direction: 2-dimensional)
3. ヒートシンクとの組合せにより、さらに高い放熱性能を発揮
4. Maintenance-free and zero running costs