Fujikura Ltd.

Thermal

Thermal

Ultra-thin thermal products

Newly developed 0.3mm ultra-thin heat pipe for mobile devices such as smartphones is ready for mass production. The newly developed internal structure maintains high thermal performance while reducing thickness.
We are developing an ultra-thin vapor chamber to further improve thermal performance. The vapor chamber is a flat plate type heat pipe, and since the entire surface has the performance of a heat pipe, high thermal performance can be obtained.

Ultra-thin heat pipe

Ultra-thin thermal products

Cold plate for high performance computer

We have developed a liquid cooling unit called a cold plate that uses a microchannel fin structure (Fin thickness 0.2 ~ 0.4 mm) for heat dissipation in high performance computers such as supercomputers and mainframes. Compared to the air-cooled method, the cold plate is space-saving and has several times more cooling performance.

For inquiries regarding research and development, please contact us from here.

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