Device Embedded PWB: WABE PackageTM
WABE Package TM is a multi-layer polyimide PWB embedded with back-ground ICs and low-profile passive components. Because of featuring extremely light slim flexible body, WABE Package TM offers the most suitable solution to the medical and the wearable electronic industries.
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Features
•Low Profile
–lamination of thin film materials
•Flexible Body
–polyimide based structure
•High Density Circuit
–via on via, pad on via arrangement with filled vias
•Chip-stack
–vertically stacked chips inside a PWB
•High Reliability
–novel conductive paste interconnection
•Ecological Production
–dry build-up process, one-batch colamination
–lead-free soldering, RoHS compliance
Specifications
|
Item |
Typical Dimensions |
|
number of layers |
4-12 layers |
|
conductor width / separation |
35μm / 35μm |
|
via pitch |
0.25mm |
|
board thickness (4-12 layers) |
0.22-0.55mm |
|
thickness of embedded IC chip |
0.08-0.15mm |
|
size of embedded IC chip |
1-8mm |
|
pitch of embedded IC pad |
0.25mm |
|
dimensions of embedded passive components |
0402, 0201 (inch) |
|
SMT CSP/BGA |
0.4mm pitch |
|
SMT passive components |
0402, 0201, 01005 (inch) |
Applications
Amplification and digital signal processing module for miniature hearing aids
New Technology 'CHIP-STACK WABE TM'
WABE Package embedded with several IC chips stacked
vertically in a board
- Further Miniaturization
- Enhanced Performance
- Extended Functionality