Device Embedded PWB: WABE PackageTM WABE Package TM is a multi-layer polyimide PWB embedded with back-ground ICs and low-profile passive components. Because of featuring extremely light slim flexible body, WABE Package TM offers the most suitable solution to the medical and the wearable electronic industries. Contact us here for inquiries. contact us Features Specifications Applications New Technology 'CHIP-STACK WABE TM' Features •Low Profile –lamination of thin film materials •Flexible Body –polyimide based structure •High Density Circuit –via on via, pad on via arrangement with filled vias •Chip-stack –vertically stacked chips inside a PWB •High Reliability –novel conductive paste interconnection •Ecological Production –dry build-up process, one-batch colamination –lead-free soldering, RoHS compliance Specifications Item Typical Dimensions number of layers 4-16 layers conductor width / separation 35μm / 35μm via pitch 0.25mm board thickness (4-16 layers) 0.22-0.9mm thickness of embedded IC chip 0.08-0.15mm size of embedded IC chip 1-8mm pitch of embedded IC pad 0.25mm dimensions of embedded passive components 0402, 0201 (inch)1005, 0603 (mm) SMT CSP/BGA 0.4mm pitch SMT passive components 0402, 0201, 01005 (inch)1005, 0603, 0402 (mm) Applications Amplification and digital signal processing module for miniature hearing aids New Technology 'CHIP-STACK WABE TM' WABE Package embedded with several IC chips stacked vertically in a board Further Miniaturization Enhanced Performance Extended Functionality Contact us here for inquiries. contact us
