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    A growth driver in the medical field positioned as a new growth market

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WABE PackageTM of a device embedded substrate wins an award from The Japan Institute of Electronics Packaging
A growth driver in the medical field positioned as a new growth market

26 June, 2019

The WABE PackageTM (Wafer And Board level device Embedded Package) technology, which is a device embedded substrate enabling ultra-miniaturization of electronic circuits, developed by Fujikura Ltd. (President & CEO: Masahiko Ito) was selected by The Japan Institute of Electronics Packaging (JIEP) for the 2018 Technological Award and received the award at the JIEP AGM held on May 23.

WABE is a board built-in to ultra-thin components realized by our proprietary technologies and is employed by many customers, including medical device manufacturers, since shipping began in 2014. Furthermore, Fujikura started mass production of Chip-stack WABE, a device embedded substrate with ultra-high density that has stacked IC chips embedded inside a board, for the first time in the world in FY2018.

Chip-stack WABE is highly rated due to the realization of the remarkable miniaturization of electronic circuits compared to other package technologies and many new models are planned for mass production in FY2019.

This award recognizes the contributions to institutions and industry through greater development of Chip-stack WABE, the component embedded technology that is attracting a great deal of attention in recent years. We plan to further spread the breadth of the WABE technology and greatly expand the fields this technology is applied to.

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