press release
Start of offering evaluation samples 60 GHz mmWave Wireless Communications Module
Fujikura Ltd.
January 27, 2020
Fujikura Ltd. (President and CEO: Masahiko Ito) has begun providing samples of 60 GHz mmWave Wireless Communications Module that uses a "high gain phased array antenna" to achieve high speed wireless communication in the 60 GHz band. This is a compact, embedded module that integrates wireless protocol processing (baseband) functions with RF (radio frequency) circuit functions including an antenna.
Various applications such as video distribution and games using VR/AR are becoming widespread in society. This has created a demand for faster and larger capacity communications, but the Sub6GHz frequency band used for 4G is too narrow to achieve this.
To solve this problem, we developed a wireless communication module that uses the millimeter wave band, which can secure a wide bandwidth. The wide bandwidth that can be secured by the millimeter wave band increases communication speeds by an order of magnitude, enabling gigabit-class high-speed communication. However, since the millimeter wave frequency band has a large transmission loss, in order to maximize the characteristics of the wireless communication module, it is necessary to wire the RF-IC (integrated circuit) and antenna in the shortest distance. Therefore, we solved this problem by selecting a low-loss LCP (liquid crystal polymer) material for the RF circuit board and integrating the RF-IC and antenna into a module. This simultaneously achieves world-class communication speeds (>2Gbps) and long-distance transmission (>500m). In addition, the "4x16 element phased array antenna", developed using Fujikura's unique antenna design and electromagnetic field analysis technology, enables stable automatic beamforming with a wide angle of ±45 degrees. It also simultaneously achieves stable antenna characteristics that fully cover the 57-71GHz frequency band.
This wireless module can be application to "backhaul equipment," "access points (AP)," "customer premises equipment (CPE)," "V2X equipment," and other devices in communication networks.
In addition to this module, Toshiba will continue to provide high-frequency compatible products to contribute to the construction of 5G and other high-speed wireless communication networks.
We will be hosting a live demo of this module at Mobile World Congress 2020 (MWC2020: Hall 5 stand 5E81) in Barcelona, so we look forward to seeing you there.
*Details about the live demo will be posted at a later date at the URL below.
[http://mmwavetech.fujikura.jp/ja/ 】
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Table 1. Main specifications
Frequency Band | 57-71 GHz (CH1-CH6) |
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EIRP | 40 dBm |
Horizontal Beamforming | ±45 deg |
interface | PCIe Gen2 x2 lane |