Fujikura Ltd.

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Thermal Technology

Thermal Technology

Heat sinks/vapor chambers

Fujikura provides high-aspect heat sinks with a high ratio of height to fin thickness as a high-performance heat sink with an aluminum extrusion and snap stack fin technology. These are chiefly used for the cooling, etc. of communication devices including CPU cooling in PCs and servers. The sink can also combine with a heat pipe or fan. We also have developed vapor chambers that can disperse heat efficiently in the planar direction. These are now being used by, for example, high-performance servers and supercomputers.

About R&D please inquire from here.

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