Electronic Materials and Components
High-tech ...in your palm
Waves of Microelectronics are sweeping the every accessible device and electronic equipment. Amid rapid technological innovation, the lead time from development to commercialization is becoming drastically shortened and high technology is put to use one after another as palm-sized products. Fujikura has a long history of developing a wide variety of wiring materials from their development and prototype production to mass-production. We intend to supply high-tech electronic components as system products that satisfy user needs.
This is our policy for electronic component development at Fujikura as a comprehensive wiring system creator.
High-density multilayer circuit wiring boards (IC-embedded substrate WABE Package)
The packaging technology to embed electronic components into printed circuit board attracts the large attention as the next generation high density packaging technology because it enables significant improvement in packaging density and downsizing.
Our laboratory is developing a Wafer And Board level device Embedding Technology (WABE TechnologiesTM) to embed a thin IC into a multi-layer FPC, combining a Wafer-Level Chip-Scale Package (WL-CSP) technology of copper-rewiring on an IC wafer and a polyimide multilayer printed circuit board technology.
We developed the world thinnest level IC embedded board by embedding a low-profile WL-CSP into a thin polyimide multilayer printed circuit board. That feature is being utilized in commercializing next-generation system-in-package (SIP) and various module substrates for mobile phones.
|Cross sectional view of the structure of an IC chip-embedded board|