Electronic Materials and Components
High-tech ...in your palm
Waves of Microelectronics are sweeping the every accessible device and electronic equipment. Amid rapid technological innovation, the lead time from development to commercialization is becoming drastically shortened and high technology is put to use one after another as palm-sized products. Fujikura has a long history of developing a wide variety of wiring materials from their development and prototype production to mass-production. We intend to supply high-tech electronic components as system products that satisfy user needs.
This is our policy for electronic component development at Fujikura as a comprehensive wiring system creator.
Low spring-back FPC
|The flexible printed circuit (FPC) boards used for DVD pickups, HDD heads and the surrounding area of a lens of a digital camera are required to have excellent characteristics of low spring-back and bendability, with the aim of lowering the spring-back and saving power consumption. To provide such FPCs, Fujikura attempts to reduce the spring-back by thinning Copper-Clad Laminates (CCLs), Cover Lay (CL), and Solder Resist (SR) that are components of the FPC using materials with low elasticity. The current, mass-produced, thinnest FPC has a thickness of 80 μm, and we are ready to mass-produce FPCs with a thickness of 45 μm. We have been successful in reducing the repulsive force to approximately a half of that of the current mass-produced products. We are now in the process of developing FPCs with a thickness of 40 μm or lower by using thinner materials.|