Fujikura Ltd.

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Electronic Materials and Components

Electronic Materials and Components

High-tech ...in your palm

Waves of Microelectronics are sweeping the every accessible device and electronic equipment. Amid rapid technological innovation, the lead time from development to commercialization is becoming drastically shortened and high technology is put to use one after another as palm-sized products. Fujikura has a long history of developing a wide variety of wiring materials from their development and prototype production to mass-production. We intend to supply high-tech electronic components as system products that satisfy user needs.
This is our policy for electronic component development at Fujikura as a comprehensive wiring system creator.

Semi-Additive FPC

With the miniaturization and sophistication of electronic devices such as mobile phones, flexible printed circuits (FPCs) with enhanced density, transmission speed, and flexibility are required. To meet these demands, we have been developing semi-additive process FPCs. The semi-additive process forms a circuit by electrolytic copper plating with resist shaped in a photo-process with high accuracy. It can create high-precision and high-density circuits. In addition, circuits produced in this process are thinner compared to the conventional FPCs, which increases flexibility. We are also working on the development of high-density circuit multilayer board technology using the semi-additive process.

About R&D please inquire from here.