Technologies to connect humans and their environment
All-polyimide interstitial via hole co-laminated (APIC) boards
||Together with advancing miniaturization and weight reduction of mobile electronic devices, there are needs for realizing lower-profile, higher-density circuit boards in devices. All-polyimide interstitial via hole co-laminated (APIC) boards are multi-layered circuit boards compatible with high-density assembling, manufactured using processing methods developed uniquely by Fujikura.
Since they employ a structure having all-polyimide-film lamination, not only are the boards kept thin even when multi-layered but they also make it possible to draw a flexible cable from any layer. Layers are connected by interstitial via holes (IVHs), realizing both high design flexibility and high-density wiring. In addition, since semi-additive circuitry can be applied to all layers, they can realize higher precision in line width along with narrower pitches, compatible with next-generation high-speed transmission technologies. In terms of reliability, they have passed both JEDEC level 1 moisture-absorption reflow testing and PCT testing, so that they are optimal for use as substrates in automotive electronics and semiconductor packages.
APIC boards are made of RoHS-compliant halogen-free materials. At the same time, their manufacturing process reflects consideration for the environment as well. Together with reducing the wastewater treatment load by employing inter-layer connection technologies using no plating, their co-lamination process that creates multiple layers in a single press regardless of number of layers also keeps down energy consumption. Through simplification of processing, the batch lamination processing reduces the volume of defective products produced while at the same time contributing, by shortening lead times, to increased competitive strength in the electronics industry, which is characterized by short product cycles.