The data transfer speed in mobile devices represented by smart phones is becoming faster and faster.

A maximum data transfer rate of 480 Mbps for USB 2.0 has increased to 5 Gbps, more than 10 times the speed of USB 2.0, for USB 3.1 Gen 1 of the next generation standard, and to 10 Gbps for USB 3.1 Gen 2.

Achievement of such high transfer rates requires the control of characteristic impedance of the signal wires and　the use of low electric loss materials in the wiring boards.

Fujikura has succeeded in controlling impedance more precisely than before by highly precise circuit formation technology.

We also have developed high-speed transmission multilayer FPCs using a low-dielectric-constant, low-dielectric-tangent material as an interlaminar adhesive for the multilayer FPCs.

These techniques have enabled the FPC to suffer less insertion losses and consequently gain USB 3.1-compliant characteristics.

We will continue to develop various products, which are capable of dealing with further increases in data transfer speed.