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Development of Chip-stack WABE PackageTM

February 23, 2015

Fujikura Ltd. (Yoichi Nagahama, President & CEO, hereinafter referred to as "the Company") has developed Chip-stack WABE PackageTM that has several IC chips embedded vertically in a circuit board and put it into use for the first time in the world.

Chip-stack WABE PackageTM uses technologies of WABE PackageTM (wafer and board level device embedded package) that has parts built in polyimide films and is currently in mass production. A technology to stack several IC chips has been long required by our customers for the purpose of downsizing electronic circuits. The Company has developed it by embedding several IC chips vertically inside multilayer printed circuits and put it into use. The use of polyimide films as the base material allows the thickness of the board as thin as 0.4 mm when the board has two-stacked IC chips.

Chip-stack WABE PackageTM is the world's first technology to respond to requests from growing industries including those of wearable computers, and medical/healthcare devices that urgently require small and thin electronic circuit boards. We will offer the most suitable solution to our customers of these industries.

Cross section of chip-stack WABE PackageTM