Fujikura's Heat Pipes / Vapor Chambers
Equipped with high-output motor and battery for electrification
Increase in number of high-performance processors installed due to autonomous driving
Qmax value (maximum heat transfer rate) doubled (55-60 → over 100W)
Thermal resistance of the heat pipe alone is reduced by approximately 40% (0.05 → 0.03℃/W)
*℃/W: Thermal resistance value
Demonstrates high performance even with a heat load exceeding 1500W
CPU, GPU, FET, etc. can be cooled in one vapor chamber
The effective thermal conductivity of VC is significantly higher than that of graphite sheet.
The number of IGBTs is increasing due to the demand for higher performance in high power applications such as industrial equipment and electric vehicles. Fujikura offers thermal solutions for various IGBT applications, such as heat sinks with heat pipes and vapor chambers.
Fujikura has been supplying heat pipes and vapor chambers for approximately 40 years.
Based on our extensive know-how and experience, we will continue to develop new products, such as electric vehicles and power semiconductors.
We will continue to propose optimal thermal solutions to customers in new fields.
Working Principle
