Technology Microcosm

Phase 4

A virtuous cycle of victory and becoming No. 1

The company's immediate target is sales of 200 billion yen, and once this goal is achieved, it aims to become the world's largest market share holder.

Fujikura has been conscious of the global market and big business since the beginning. The symbol of this is the establishment of the Thailand PCTT in 1988. manufacturing technology transfer from Japan was carried out promptly, and a mass production system with high-quality labor was established. In addition, we have consistently adhered to the concept of "roll-to-roll" and have completed a unique manufacturing system that covers the entire process with a self-contained integrated line. After that, supported by strong demand for FPCs, the company expanded its Platchinburi plant in charge of back-end processes in 1996, and in 2001, the Ayutthaya plant, which introduced state-of-the-art manufacturing equipment and technology, began operation. PCTT now has the world's largest production capacity as a specialized FPC factory, enabling a substantial supply of various FPC products for future growth markets. In this way, Fujikura's FPC business formation is now completely confronting the global market, along with the Tohoku Fujikura and Sakura Development Center, which are in charge of prototyping, evaluation, pre-production, and new product development, as well as FESL, which was established in Shanghai in 2001, and the Sales strategy Force deployed around the world.

On the other hand, while constantly pursuing the possibilities of FPC applications, it is also taking on numerous technical challenges. For example, polyimide FPCs can be mounted with components by solder like regular rigid printed circuit boards (RPCs), and have excellent electrical and mechanical properties such as dielectric constant and outgassing, so COF (Chip On Flex) assembly that directly mounts semiconductor elements has been put into practical use. The company is rapidly expanding its application to display devices such as liquid crystals, storage media devices such as HDDs, communication devices such as mobile phones, and packaged devices such as CSP (Chip Scale Package). Fujikura also thoroughly pursues this technological trend. For example, we have accumulated a number of achievements in "wire bond COF", which directly loads ICs with wire bonds, and have expanded their applications in plasma display panels (PDPs) in particular. In addition, it is pioneering in the "flip-chip COF" that joins semiconductors with a face-down. In addition, it offers fine-pitch FPC, multilayer FPC, SMT (Surface Mount Technology) high-density mounting, and wafer-level CSP (high-density package) ...... and so on, and lineup products that are closer to the semiconductor area. In addition, Fujikura is actively developing products that utilize Fujikura's comprehensive technological capabilities, such as FPC and MBSW (membrane switch) composite products.

The company's immediate target is to achieve sales of 200 billion yen in the future, and once this goal is achieved, it aims to become the world's largest manufacturer of this product.
As the name suggests, FPCs are flexible, and can now be incorporated into any minute space. They will no longer be used in conventional ways, but will be required to be used under even harsher conditions in the future, and technological evolution will likely be pushed to ever-more extreme limits. Therefore, Fujikura's engineers must always think flexibly! They will continue to maintain a resilient and challenging attitude, able to effortlessly overcome any impossible challenge. And as we build a track record that earns our customers' gratitude, saying, "It was only because we incorporated Fujikura-made FPCs that we were able to dominate the global market," we aim to build ideal win-win relationships with our customers. As a group of true professionals in the electronics industry...