Solving the heat problem Fujikura Thermal Solutions
Fujikura will make full use of its advanced thermal design technology, Used for cooling in a wide range of applications, including computers, industrial machinery, and automotive systems. We offer thermal solutions, including heat transport devices and optimal heat management solutions.
Fujikura's cooling technology is It contributes to a variety of situations.
Paper Chamber
Cold Plate
Heat pipe module
Stiffener
Heat spreader
Paper Chamber
Heat pipe module
Cold plates that support data center
The internal flow path can be freely customized. To efficiently cool data center, Fujikura's technology
With the dramatic improvement in the performance of computers and servers, thermal management related to cooling semiconductors such as CPUs and GPUs, which generate a lot of heat, has become a critical issue. data center worldwide consume enormous amounts of electricity, with 40% of that going to cooling systems. This raises concerns not only about operating costs but also about the impact on the global environment.
What is a cold plate?
It is a cooling module mainly made of copper, a material with high thermal conductivity, and consists of a plate that comes into contact with the heat-generating element of electronic equipment and transfers that heat to the cooling water inside, and pipes that carry the cooling water.
Fujikura's proprietary development Next-generation cold plate
MLCPs have a multilayer structure and their internal flow paths can be freely customized, This allows you to concentrate cooling performance on areas where heat generation is particularly concentrated.
Conventional cold plates
Fujikura Next Generation Cold Plate
High heat generation and uneven heat density. This is a next-generation cold plate optimized for semiconductor cooling.
Fujikura's technology enables customization
Precise metal joining technology
Numerous thin metal sheets with short channel patterns are laminated and bonded together. This creates countless narrow, short, three-dimensional channels inside.
Advanced design technology
By freely designing the density and saturation of the flow path, the balance between thermal performance and pressure loss is optimized, improving the overall efficiency of the system.
Custom Design
By combining these technologies, we have created an optimized design that focuses on cooling hot spots in high-performance CPUs/GPUs where heat density is uneven, by concentrating cooling on the heat-generating components.
High efficiency and space saving
Compared to conventional cold plates of the same size, it achieves a reduction in thermal resistance of more than 20%. It provides stable operation through space-saving and efficient thermal management, while also contributing to a reduction in environmental impact.
Fujikura's cooling expertise cultivated over half a century
Since supplying large, long heat pipes for cooling power cables in the 1980s, Fujikura has been a leading supplier of heat pipes for various applications. We have contributed to solving thermal problems by developing and providing a wide range of cutting-edge thermal-related products. We will continue to leverage our extensive experience to propose the most suitable thermal solutions.
The world's leading supercomputers utilize high-performance CPUs that generate significant heat, so Fujikura's cold plates with a microchannel fin structure, which offer space-saving design and highly efficient cooling performance, are employed.