Fujikura Ltd.

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Technologies to connect humans and their environment

Technologies to connect humans and their environment

Semi-Additive FPC


With the miniaturization and sophistication of electronic devices such as mobile phones, flexible printed circuits (FPCs) with enhanced density, transmission speed, and flexibility are required. To meet these demands, we have been developing semi-additive process FPCs. The semi-additive process forms a circuit by electrolytic copper plating with resist shaped in a photo-process with high accuracy. It can create high-precision and high-density circuits. In addition, circuits produced in this process are thinner compared to the conventional FPCs, which increases flexibility. We are also working on the development of high-density circuit multilayer board technology using the semi-additive process.

 

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