Fujikura Ltd.

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Technologies to connect humans and their environment

Technologies to connect humans and their environment

Low spring-back FPC


The flexible printed circuit (FPC) boards used for DVD pickups, HDD heads and the surrounding area of a lens of a digital camera are required to have excellent characteristics of low spring-back and bendability, with the aim of lowering the spring-back and saving power consumption. To provide such FPCs, Fujikura attempts to reduce the spring-back by thinning Copper-Clad Laminates (CCLs), Cover Lay (CL), and Solder Resist (SR) that are components of the FPC using materials with low elasticity. The current, mass-produced, thinnest FPC has a thickness of 80 μm, and we are ready to mass-produce FPCs with a thickness of 45 μm. We have been successful in reducing the repulsive force to approximately a half of that of the current mass-produced products. We are now in the process of developing FPCs with a thickness of 40 μm or lower by using thinner materials.

 

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