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Device Embedded PWB: WABE PackageTM

WABE Package TM is a multi-layer polyimide PWB embedded with back-ground ICs and low-profile passive components. Because of featuring extremely light slim flexible body, WABE Package TM offers the most suitable solution to the medical and the wearable electronic industries. 

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Features

•Low Profile
        –lamination of thin film materials
•Flexible Body
        –polyimide based structure
•High Density Circuit
        –via on via, pad on via arrangement with filled vias
•Chip-stack
        –vertically stacked chips inside a PWB
•High Reliability
        –novel conductive paste interconnection
•Ecological Production
        –dry build-up process, one-batch colamination
        –lead-free soldering, RoHS compliance

Specifications

 

Item

Typical Dimensions

number of layers

4-11 layers

conductor width / separation

35μm / 35μm

via pitch

300μm

board thickness (4-11 layers)

0.22-0.55mm

thickness of embedded IC chip

0.08-0.15mm

size of embedded IC chip

1-8mm

pitch of embedded IC pad

0.3mm

dimensions of embedded passive components

0402, 0201 (inch)
1005, 0603 (mm)

SMT CSP/BGA

0.4mm pitch

SMT passive components

0402, 0201, 01005 (inch)
1005, 0603, 0402 (mm)

Applications

Amplification and digital signal processing module for miniature hearing aids


 

 

 

                       



New Technology 'CHIP-STACK WABE TM'

WABE Package embedded with several IC chips stacked
vertically in a board

  • Further Miniaturization
  • Enhanced Performance
  • Extended Functionality

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