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CSR

CSR Integrated Report

Fujikura Group CSR Integrated Report 2015
[ISO 26000 Core Subject] Organizational Governance

Research and Development

New Research & Development Activities for the Future

Kenji Nishide

Kenji Nishide
Executive Officer
Head of the Advanced Technology Laboratory

The Advanced Technology Laboratory integrates research groups engaging in the three technological fields of photonics, energy and electronics, and conducts research in a comprehensive manner in these fields, including overlapping areas. A characteristic feature of the laboratory is that members conducting R&D for materials and those focusing on the aforementioned research fields collaborate together to make achievements under the slogan, "Material to Products." Their research results are used in the development of automotive products, fiber lasers, high-frequency functional devices, and telecommunication components. We will continue conducting activities to develop next-generation technologies and deliver attractive products that will be needed by customers around the world.

Introduction of a laboratory: Advanced Technology Laboratory

Advanced Technology Laboratory

Advanced Technology Laboratory

Major research fields

Photonics

The laboratory has contributed to the advancement of the field, including providing optical fibers for use in experiments on large-capacity transmission, which are conducted to develop next-generation optical communication systems. We will continue using our optical technologies to take on the challenge of developing next-generation communication devices.

Photonics

Energy

Energy

The laboratory will continue to take on the challenge of developing materials for eco-friendly technologies, including yttrium-based high-temperature superconductive wires that enable efficient energy transmission as well as dye-sensitized solar cells that are optimal for use in the energy harvesting (eco-friendly power generation) field.

Electronics

The laboratory will focus on leading-edge technologies, including those for sensor systems, circuit boards, and printed electronics that helps deliver high value-added products based on printing technologies.

Electronics

New Products and Technologies

■Development of High-power Pulse Fiber Laser FLP-G75S

Pulse fiber lasers found widespread applications in the micromachining field, especially in metal marking and scribing and now require higher performance.
Fujikura has developed a high-power pulse fiber laser rated at 75 W (FLP-G75S). This laser has achieved the industry's top-level features including high-power (75W average output power, 1.1mJ pulse energy) and high beam quality (M2?1.7). They will contribute greatly to productivity increases by enabling machining in hard-to-machine areas (Fig.1), deeper and higher speed machining (Fig.2). In addition, the new device has been substantially more compact and lighter in weight than existing ones, which helps drastic improvements in flexibility in assembling to laser equipment or systems.

FLP-G75S

FLP-G75S

■Fujikura Honored by the Laser Society of Japan with Laser Industry Award for Excellent Products

Fujikura was honored by the society with "laser industry award 2015 for excellent products" for our fiber laser product line including 4kW continuous wave fiber laser.

Laser Industry Award

Laser Industry Award

Laser Industry Award

■Start of Sales of Large-core Fiber Cleavers and Fiber Recoaters

Fujikura is pleased to announce the development and the start of sales of large-core fiber cleavers (CT-105, CT-106) and fiber recoaters (FSR-05, FSR-06, FSR-07), tools for use in the assembly of equipment at plants and research and development.

▼Large-core Fiber Cleaver (CT-105, CT-106)

A large-core optical fiber refers to a quartz-based fiber with a cladding diameter larger than that of a common telecommunications fiber. Large-core fibers are used in industries such as those of lasers and other devices, where transmission of high-power light energy is needed, and sensors.
We have developed two models of large-core fiber cleavers capable of cutting a fiber with a maximum clad diameter of 1,250 μm and launched the sales.
Since the products have a system for automatically adjusting forces to hold optical fibers, they are also suitable for cleaving photonic crystal fibers and capillaries (hollow glass tubes). The CT-106 is capable of cleaving diagonally.

▼Fiber Recoaters (FSR-05, FSR-06, FSR-07)

A method to protect a spliced section of an optical fiber is coating the stripped glass with UV-cured resin. This method can keep a spliced section thinner and lighter than the method using a reinforcement sleeve.
We have developed and started marketing of three models of fiber recoaters that offer users options regarding the strength checking system of a spliced section according to use. These products achieved greater accuracy in finished shape, longer life of consumable products, and higher maintainability than previous models.

CT-106

CT-106

FSR-07

FSR-07

■Development of Chip-stack WABE PackageTM

Fujikura has developed Chip-stack WABE PackageTM (wafer and board level device embedded package), a circuit board into which several IC chips are embedded vertically, and put it into use for the first time in the world.
Chip-stack WABE PackageTM uses technologies of WABE PackageTM, which has components built in polyimide multi-layer circuits and is currently in mass production. The method of stacking IC chips allowed dramatic downsizing of the electronic circuit. Through the use of polyimide films as the base material, the board with two-stack IC chips achieved a thickness of as small as 0.4mm.
Chip-stack WABE PackageTM is the world's-first technology to meet the needs in industries, where smaller and thinner electronic circuits are strongly demanded, such as those of wearable electronics and medical / healthcare devices. We will supply the most suitable solution to our customers in these advancing industries.

Cross-sectional view of Chip-stack WABE PackageTM

Cross-sectional view of Chip-stack WABE PackageTM