The 8th IC Packaging Technology Expo (ICP2007) was held over the three days from January 17 to 19 at Tokyo Big Sight. Fujikura exhibited and introduced wafer level packages (WLP), various types of state-of-the-art semiconductor packages with advanced WLP technology, and compact lightweight plastic packages for MEMS sensors.
We received an extremely large number of inquiries relating to areas such as wafer level MEMS packages using Through Silicon Vias(TSVs), and batch laminated printed circuits boards with WLP embeded, and once again were able to recognize the high level of interest in this field. |
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